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Philips Semiconductors
Product specification
Rectifier diodes ultrafast, rugged
FEATURES
* Low forward volt drop * Fast switching * Soft recovery characteristic * Reverse surge capability * High thermal cycling performance * Low thermal resistance
BYW29EB, BYW29ED series
SYMBOL
QUICK REFERENCE DATA
VR = 150 V/ 200 V VF 0.895 V IF(AV) = 8 A IRRM = 0.2 A trr 25 ns
k tab
a 3
GENERAL DESCRIPTION
Ultra-fast, epitaxial rectifier diodes intended for use as output rectifiers in high frequency switched mode power supplies. The BYW29EB series is supplied in the SOT404 surface mounting package. The BYW29ED series is supplied in the SOT428 surface mounting package.
PINNING
PIN 1 2 3 tab DESCRIPTION no connection cathode1 anode cathode
SOT404
tab
SOT428
tab
2 1 3
1
2 3
LIMITING VALUES
Limiting values in accordance with the Absolute Maximum System (IEC 134) SYMBOL PARAMETER VRRM VRWM VR IF(AV) IFRM IFSM IRRM IRSM Tj Tstg Peak repetitive reverse voltage Working peak reverse voltage Continuous reverse voltage Average rectified forward current Repetitive peak forward current Non-repetitive peak forward current Peak repetitive reverse surge current Peak non-repetitive reverse surge current Operating junction temperature Storage temperature square wave; = 0.5; Tmb 128 C square wave; = 0.5; Tmb 128 C t = 10 ms t = 8.3 ms sinusoidal; with reapplied VRRM(max) tp = 2 s; = 0.001 tp = 100 s CONDITIONS BYW29EB/ BYW29ED - 40 MIN. -150 150 150 150 8 16 80 88 0.2 0.2 150 150 MAX. -200 200 200 200 UNIT V V V A A A A A A C C
1. It is not possible to make connection to pin 2 of the SOT428 or SOT404 packages.
November 1998
1
Rev 1.300
Philips Semiconductors
Product specification
Rectifier diodes ultrafast, rugged
ESD LIMITING VALUE
SYMBOL VC PARAMETER Electrostatic discharge capacitor voltage CONDITIONS Human body model; C = 250 pF; R = 1.5 k
BYW29EB, BYW29ED series
MIN. -
MAX. 8
UNIT kV
THERMAL RESISTANCES
SYMBOL PARAMETER Rth j-mb Rth j-a Thermal resistance junction to mounting base Thermal resistance junction to ambient CONDITIONS MIN. SOT404 and SOT428 packages, pcb mounted, minimum footprint, FR4 board TYP. MAX. UNIT 50 2.7 K/W K/W
ELECTRICAL CHARACTERISTICS
Tj = 25 C unless otherwise specified SYMBOL PARAMETER VF IR Qrr trr1 trr2 Vfr Forward voltage Reverse current Reverse recovered charge Reverse recovery time Reverse recovery time Forward recovery voltage CONDITIONS IF = 8 A; Tj = 150C IF = 8 A IF = 20 A VR = VRWM VR = VRWM; Tj = 100C IF = 2 A; VR 30 V; -dIF/dt = 20 A/s IF = 1 A; VR 30 V; -dIF/dt = 100 A/s IF = 0.5 A to IR = 1 A; Irec = 0.25 A IF = 1 A; dIF/dt = 10 A/s MIN. TYP. MAX. UNIT 0.8 0.92 1.1 2 0.2 4 20 15 1 0.895 1.05 1.3 10 0.6 11 25 20 V V V A mA nC ns ns V
November 1998
2
Rev 1.300
Philips Semiconductors
Product specification
Rectifier diodes ultrafast, rugged
BYW29EB, BYW29ED series
I
dI F dt
F
0.5A IF
t
rr time
0A I rec = 0.25A IR trr2
Q I R I
s
10%
100%
rrm
I = 1A R
Fig.1. Definition of trr1, Qs and Irrm
Fig.4. Definition of trr2
I
F
12 10 8
PF / W
Vo = 0.791 V Rs = 0.013 Ohms
BYW29
Tmb(max) / C 108 D = 1.0 115 0.5 122 129 136 143
T t
time VF V VF time fr
6 0.1 4
0.2
I
tp
D=
tp T
2 0
0
2
4
6 IF(AV) / A
8
10
150 12
Fig.2. Definition of Vfr
Fig.5. Maximum forward dissipation PF = f(IF(AV)); square current waveform where IF(AV) =IF(RMS) x D.
PF / W
Vo = 0.791 V Rs = 0.013 Ohms
R
8 7 6
BYW29
Tmb(max) / C a = 1.57 1.9 2.2
122 125.5 129 132.5 136 139.5 143 146.5
D.U.T. Voltage Pulse Source
5 4 3 4
2.8
Current shunt
2
to 'scope
1 0 0 1 2 3 4 IF(AV) / A 5 6 7 150 8
Fig.3. Circuit schematic for trr2
Fig.6. Maximum forward dissipation PF = f(IF(AV)); sinusoidal current waveform where a = form factor = IF(RMS) / IF(AV).
November 1998
3
Rev 1.300
Philips Semiconductors
Product specification
Rectifier diodes ultrafast, rugged
BYW29EB, BYW29ED series
trr / ns 1000
100 Qs / nC
100
IF=10A
IF=10A 5A 2A 1A 10
IF=1A 10
1
1.0
1 10 dIF/dt (A/us) 100
1.0
10 -dIF/dt (A/us)
100
Fig.7. Maximum trr at Tj = 25 C.
Fig.10. Maximum Qs at Tj = 25 C.
10
Irrm / A
10
Transient thermal impedance, Zth j-mb (K/W)
IF=10A 1 IF=1A
1
0.1
0.1
0.01
P D tp D= tp T t
0.01 1 10 -dIF/dt (A/us) 100
0.001 1us
T
10us
100us 1ms 10ms 100ms 1s 10s pulse width, tp (s) PBYL1025
Fig.8. Maximum Irrm at Tj = 25 C.
Fig.11. Transient thermal impedance; Zth j-mb = f(tp).
30
IF / A Tj=150 C Tj=25 C
BYW29
20
typ 10
max
0 0
0.5
1 VF / V
1.5
2
Fig.9. Typical and maximum forward characteristic IF = f(VF); parameter Tj
November 1998
4
Rev 1.300
Philips Semiconductors
Product specification
Rectifier diodes ultrafast, rugged
MECHANICAL DATA
Dimensions in mm Net Mass: 1.4 g
10.3 max
BYW29EB, BYW29ED series
4.5 max 1.4 max
11 max 15.4
2.5 0.85 max (x2) 2.54 (x2)
0.5
Fig.12. SOT404 : centre pin connected to mounting base.
MOUNTING INSTRUCTIONS
Dimensions in mm
11.5
9.0
17.5 2.0
3.8
5.08
Fig.13. SOT404 : soldering pattern for surface mounting.
Notes 1. Epoxy meets UL94 V0 at 1/8".
November 1998
5
Rev 1.300
Philips Semiconductors
Product specification
Rectifier diodes ultrafast, rugged
MECHANICAL DATA
Dimensions in mm Net Mass: 1.1 g
6.73 max 1.1
BYW29EB, BYW29ED series
seating plane 2.38 max 0.93 max 5.4
tab
4 min 6.22 max 10.4 max 4.6
2 1
2.285 (x2)
0.5 min
0.5 0.3 0.5
3
0.8 max (x2)
Fig.14. SOT428 : centre pin connected to tab.
MOUNTING INSTRUCTIONS
Dimensions in mm
7.0
7.0
2.15 2.5
1.5
4.57
Fig.15. SOT428 : minimum pad sizes for surface mounting.
Notes 1. Plastic meets UL94 V0 at 1/8".
November 1998
6
Rev 1.300
Philips Semiconductors
Product specification
Rectifier diodes ultrafast, rugged
DEFINITIONS
Data sheet status Objective specification Product specification Limiting values
BYW29EB, BYW29ED series
This data sheet contains target or goal specifications for product development. This data sheet contains final product specifications.
Preliminary specification This data sheet contains preliminary data; supplementary data may be published later.
Limiting values are given in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of this specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Application information Where application information is given, it is advisory and does not form part of the specification. (c) Philips Electronics N.V. 1998 All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner. The information presented in this document does not form part of any quotation or contract, it is believed to be accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license under patent or other industrial or intellectual property rights.
LIFE SUPPORT APPLICATIONS
These products are not designed for use in life support appliances, devices or systems where malfunction of these products can be reasonably expected to result in personal injury. Philips customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such improper use or sale.
November 1998
7
Rev 1.300
Philips Semiconductors
Product specification
Rectifier diodes ultrafast, rugged
DEFINITIONS
Data sheet status Objective specification Product specification Limiting values
BYW29EB, BYW29ED series
This data sheet contains target or goal specifications for product development. This data sheet contains final product specifications.
Preliminary specification This data sheet contains preliminary data; supplementary data may be published later.
Limiting values are given in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of this specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Application information Where application information is given, it is advisory and does not form part of the specification. (c) Philips Electronics N.V. 1998 All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner. The information presented in this document does not form part of any quotation or contract, it is believed to be accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license under patent or other industrial or intellectual property rights.
LIFE SUPPORT APPLICATIONS
These products are not designed for use in life support appliances, devices or systems where malfunction of these products can be reasonably expected to result in personal injury. Philips customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such improper use or sale.
November 1998
8
Rev 1.300

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